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Responsibilities: ? Support, contribute and promote a safe work environment. ? Perform signal integrity simulations for engineering designs on connectors or semiconductor IC chip test sockets or probe heads ? Develops technology and processes for high-speed measurement of test sockets, connectors, PCB’s and other components. ? Designs and develops PCBs and fixtures for testing and characterization of engineering designs. ? Set up machines, equipment and design/develop process fixtures. ? Responsible for prototyping and evaluation of new products in leading edge applications. ? Interprets customer specifications and writes test procedures to qualify new and existing products. ? Recommends capital investments for leading edge technologies that will keep the company on the forefront of the industry. ? Specify tooling and equipment needed to support the production build. ? Provide technical support to organizational stakeholders (Production, Quality, Marketing and Sales). ? Consult with Sales in quoting customer requirements and bid preparation. ? Participate and contribute to team training, development, mentoring and audits. ? Demonstrate behaviors consistent with company policies. Requirement: ? General educational, experience and competency requirements defined in current revision of the “Engineering Career Ladder”. ? Knowledge of RF, Digital and Power cables and connectors or related knowledge. ? Familiar using HFSS to perform simulation to generate IL, RL, TDR, and Crosstalk. ? Understanding of RF/Signal Integrity simulations on electric-mechanical structures. ? Understanding of RF/Digital test equipment, software and procedures. Be able to use VNA to perform electrical measurement. ? Ability to perform Root Cause Analysis utilizing standard problem-solving tools and methodologies. ? Knowledge of 3D modeling using drawing and simulation packages. ? Knowledge of PCB design