Requirements: l min 10years working experience in power semiconductor . l Hands on skill for power semiconductor SMT process (Pink Vadu, Infotech, SMT reflow and die attach sintering process). l lots of experience for DOE and statistic analysis. l knowledge for power module (case, transfer molded) structure /technology trend, overall power packaging process and material property what is using for power package. l understand APQP process, DFMEA,PFMEA, Control plan. Good English communication and reporting skill(mandatory option) Job description: SMT process set up, DOE, Sample build, jig design, trouble shooting