RESPONSIBILITIES: 1. Develop new package type and package structure 2. Survey new material to meet new package process, reliability, and cost requirements 3. Collect packaging information/requirement from TME/DE/Marketing/Competitor for next generation package development 4. Work with assembly house and material vendor to develop and qualify the new material and new package 5. Provide the technical support to DE/TME groups for package definition, selection, and cost analysis 6. Sum up the experience of package design & process, and maintain package design rule & update package road map 7. Perform other tasks assigned by supervisor REQUIREMENTS: 1. Intensive hands-on experience on new package introduction/development 2. Good knowledge of package development principles 3. Knowledge about semiconductor supply chain, familiar with assembly sub-contractors, and packaging material vendors 4. Fluent in spoken and written English 5. Familiar with AutoCAD or Cadence software is a plus 6. Bachelor/master’s degree with 10+ years direct related experience, or Doctor degree with 5+ related experience